Fusion startup Helion lines up potential $175M CHIPS award to develop advanced semiconductors
Helion Energy, a Washington-based fusion startup building a commercial fusion plant set to operate in 2028, announced a letter of intent with the U.S. Department of Commerce for up to $175 million in CHIPS R&D funding for semiconductor development over three years. The government will receive a $175 million non-voting equity stake, while Helion commits $50 million in private investment. Funds will support high-voltage semiconductor R&D in Washington and next-generation development in partnership with GlobalFoundries.
Key points
- Up to $175M CHIPS Award from U.S. Department of Commerce
- Funding supports fusion-specific semiconductor development
- Partnership with GlobalFoundries for chip manufacturing R&D
- Helion's fusion plant targeting 2028 operations
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